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Durostone
CAG762 material is designed specifically to meet the soldering
requirements of printed circuit board assemblers utilizing
tin wave solder, vapor phase or infra-red reflow equipment.
Durostone CAG762 is the optically sensitive version of
our ESD grade material.
Durostone CAG762 has a surface resistant to solder adhesion,
solvents and cleaning agents. In addition the material
is easier to handle in production than metal fixtures
because of its lighter weight and lower thermal conductivity.
Typical properties of the composite include:
g/cm3Color
.................................... Grey
Density
....................................... 1.85 g/cm cubed
Water
absorption .............................. < 0.2%
Surface Resistivity ........................... 10(power
of 5)- 10(power of 8)
OhmsThermal
Conductivity ...................... .25 W/mK
Flexural
Strength perpendicular (3 point support)
Coefficient
of linear expansion ............... 360 Mpa
degrees
C° .................................... 11 10-6/K
(bet. 30° degrees & 200
Maximum
operating temp. (10-20 sec) ........... 350° C
Standard
operating temp ....................... 260° C
Modulus
of elasticity ......................... 18,000 Mpa
Specific
heat capacity ........................ 930 J/kg K
Thickness
Tolerances Parallelism
3-12 mm +/- .10 mm (thickness) ± .10 mm
+/- .10 mm (flatness per 300 mm squared) ± .08 mm
The above mentioned values are average values based on
random tests. |
